VEM Vacuum Engineering and Materials



  • Chemical Symbol: Au
  • Atomic Number:79
  • Atomic Weight: 169.97
  • Density: 19.30 g·cm-3
  • Melting Point: 1337.33 K
  • Boiling Point: 3125K
  • Heat of Fusion: 12.55 kJ·mol−1
  • ​​Heat of Vaporization: 324 kJ·mol−1
  • Molecular Heat Capacity: 25.418 J·mol−1·K−1
  • Electrical Resistivity: (20 °C) 22.14 nΩ·m
  • Thermal Conductivity: 318 W·m−1·K−1
  • Thermal Expansion: (25 °C) 14.2 µm·m−1·K−1


Atomic Weight: 169.97

Data Storage

The demand for data storage seems endless. Big data is driving the requirement for big data storage devices. New materials continue to enable innovative solutions to today's data storage challenges. VEM is working with the major data storage suppliers to provide these solutions.

Advanced Packaging

IC packaging is the final step in the semiconductor fabrication process before testing and shipping devices to customers. A large number of different types of packages exist and new ones continue to be developed. In addition, integrated circuit dies are often developed for direct connection to a substrate. In flip chip systems the IC is connected by solder bumps to a substrate. All of these packaging technologies require new material. VEM is working with a breadth of packaging suppliers to develop new solutions to the challenges they're facing.


Micro-Electro-Mechanical Systems, or MEMS, are micro-structures created using semiconductor fabrication processes. MEMS devices are widely used in consumer, communication, and computer applications. They include gyroscopes, accelerometers, inertial measurement units, pressure sensors, inertial sensors, RF devices, microphones, micro-bolometers, and inkjet heads. VEM is working with many of the leading MEMS suppliers and foundries for both process and packaging solutions.


Light-Emitting Diodes, or LED's are devices that emit infrared or visible light when charged with an electric current. LED's are rapidly being adopted as an efficient and low energy solution in a broad range of applications from indicator lamps to general lighting. LED's are fabricated on compound semiconductor substrates such as GaAs and GaN. VEM is working with many of the largest suppliers of LED devices. We're helping them develop new materials and new solutions to their R&D and production challenges.

Our components include:

RF Wireless Communications

The rapid growth of smartphones has driven a demand for high speed communications devices. The explosive growth of this industry requires significant high quality materials to keep up with the constant new innovations. These materials must be of high purity and low resistivity to provide maximum performance. We supply ultra high purity gold Evaporation Materials in any shape or size you may need at fair prices. VEM is working with all of the major RF Wireless device manufacturers to find solutions to their next generation devices.


The photonics industry is one of the fastest growing segments of the high technology industry. Photonics covers a huge breadth of rapidly expanding industries throughout the world. From fiber optic communications to photonic computing, VEM is working with companies to create innovative new technology. Our semiconductors and thin film solutions are world class and will help you keep pace with this fast paced industry. Whether you’re in optical communications or optical coatings, we provide a breadth of materials to meet your needs.

Our components include: