Sputtering Targets
Vacuum Engineering & Materials (VEM) is a trusted state-of-the-art U.S.-based supplier of high-performance sputtering targets engineered for precision physical vapor deposition (PVD) processes. We offer purities from 99.9% to 99.999+%, supporting deposition systems across semiconductor, data storage, display and other industries.
Our sputtering targets are available in a wide range of form factors including round, rectangular, ConMag, Delta, Ring, Rotatable, and multi-tiled geometries engineered to support 150mm to 450mm wafer fabrication platforms.
Sputtering Targets
VEM supplies state-of-the-art sputtering targets in purities ranging from 99.9% to 99.999+%, including popular targets for all PVD systems; round, rectangular, ConMag, Delta, Ring, Rotatable and multi-tiled. Supporting 150-450mm wafer fabs.
How Custom Sputtering Targets Work in Precision PVD Processes
VEM manufactures high-purity sputtering targets engineered for demanding physical vapor deposition (PVD) environments across semiconductor, advanced packaging, data storage and display manufacturing. Our materials are designed to support stable deposition rates, consistent film uniformity, and improved target utilization across high-volume production environments.
We supply custom sputtering targets for a wide range of cathode configurations and OEM deposition systems, including planar, rotary, and magnetron sputtering assemblies. Available target configurations include:
- Round sputtering targets
- Rectangular sputtering targets
- Rotary sputtering targets
- ConMag targets
- Delta targets
- Ring targets
- Multi-tile target assemblies
- Bonded sputtering targets
- Precious metal sputtering targets
- Magnetic sputtering target designs
Learn more about how to choose the right sputtering targets for your application.
Common Sputtering Target Materials & Applications
VEM manufactures high-purity sputtering targets for semiconductor, display, and advanced PVD applications.
| Material | Common Use | Key Performance Benefit |
| Aluminum (Al) | Semiconductor metallization | Excellent conductivity |
| Aluminum Silicon Copper (AlSiCu) | Integrated circuits | Improved electromigration resistance |
| Copper (Cu) | Advanced packaging | High conductivity and deposition stability |
| Gold (Au) | RF, optics, and semiconductor applications | Corrosion resistance and conductivity |
| Platinum (Pt) | High-temperature thin films | Chemical stability |
| Palladium (Pd) | Sensors and electronics | Oxidation resistance |
| Nickel (Ni) | Magnetic films and coatings | Strong magnetic properties |
| Titanium (Ti) | Adhesion and barrier layers | Excellent adhesion characteristics |
| Silicon (Si) | Semiconductor deposition | Excellent process compatibility |
High-Purity Sputtering Target Manufacturing
Our high-purity source materials and specialized manufacturing techniques allow VEM to produce high-quality sputtering targets for OEM platforms across semiconductor and advanced PVD applications. Critical material properties we control include:
- Density
- Grain size
- Grain orientation
- PPM levels of specific elements
- Gas content
- Surface roughness
- Thermal stability
- Target utilization optimization
Quality Control, Traceability & Certificate of Analysis
VEM maintains stringent quality control standards to ensure every sputtering target meets demanding semiconductor and thin film deposition requirements. Each target ships with a Certificate of Analysis (COA) including purity verification, trace element analysis, and lot traceability.
All target materials are laser scribed with individual lot numbers for full traceability back to original source analysis and production batches.
What Custom Solutions Does VEM Offer?
We offer CMM services to map the profile of our customers’ sputtering targets. Using the CMM profile, we are able to reverse engineer enhanced target designs that help increase target utilization, reduce target changes, improve uptime, and lower material waste.
For precious metal sputtering targets and magnetic materials, engineered profiles can help improve material consumption and extend target life compared with conventional planar target designs.
We Can Recycle Your Targets for Credit or Cash
VEM offers closed-loop sputtering target or metal reclamation, allowing customers to return used targets and reclaim valuable raw materials. This helps reduce material costs, improve sustainability, and maximize return on investment. Reclamation program benefits include:
- Recycling for precious and non-precious metals
- Quarterly credit or cash-back programs
- Tracking of returned material quantities
- Improved sustainability and material recovery support
Backing Plates & Bonding Options
To support thermal management and mechanical stability, we offer a range of bonding services and custom backing plates designed for both standard and magnetic target materials. Bonding methods include:
- Indium bonding for excellent thermal conductivity
- Elastomer bonding for temperature-sensitive assemblies
- Compatibility with most OEM cathode assemblies
Our engineers can advise on thermal mismatch mitigation, plate selection, and bonding layer thickness based on your specific deposition environment.
What Other Capabilities Does VEM Provide?
In addition to our core sputtering target manufacturing, VEM provides advanced material processing and metallurgical services, including:
Melting
VEM provides advanced melting capabilities for high-purity sputtering target materials and specialty alloys.
- Induction Melting (Au, Pt, Pd)
- Vacuum Induction Melting (VIM) in 150, 200, and 300 lb crucibles
VEM also offers high-purity crucible liners for evaporation systems.
Swaging & Drawing
Our swaging and drawing services support custom material sizing and precision wire or rod production.
- Rod diameter reduction
- Custom rod and wire drawing techniques
Cutting
VEM offers high-precision cutting services for sputtering target preparation and custom material fabrication.
- High-precision material cutting
- Target preparation services
Proprietary Cleaning
Our proprietary cleaning processes help maintain surface quality and reduce contamination in critical PVD applications.
- Surface conditioning
- Contamination removal
- Precision cleaning support
Applications and Markets Served
VEM’s sputtering targets are trusted by customers in critical high-tech sectors. Common use cases include:
- Advanced Packaging – for redistribution layers, barrier films, and passivation
- Data Storage – for hard disk drives and magnetic recording media
- Emerging Display Technologies – for OLED, MicroLED, and flexible electronics
- Foundry – including logic and memory device fabrication
- LED Manufacturing – for contact layers, reflectors, and encapsulation
See all markets that we support.
If you don’t see the exact sputtering target you need, just ask. Our expert team is ready to deliver high-performance materials tailored to your deposition process.
Contact us today to request a quote or discuss a custom solution.
Frequently Asked Questions About Sputtering Targets
Sputtering targets are used in physical vapor deposition (PVD) processes to create thin films on substrates. They are commonly used in semiconductor manufacturing, OLED displays, optical coatings, and data storage applications where film purity and deposition consistency are critical.
Sputtering targets are manufactured from high-purity metals, alloys, ceramics, and composite materials. Common materials include aluminum, copper, gold, platinum, palladium, titanium, nickel, and silicon for semiconductor and advanced PVD applications.
Sputtering target purity is important because impurities can affect thin film quality, electrical performance, and semiconductor yield. High-purity sputtering targets help reduce contamination and improve process consistency in advanced PVD environments.
Planar sputtering targets use a flat geometry, while rotary sputtering targets use a cylindrical rotating design. Rotary targets typically provide higher material utilization, longer production runs, and more uniform erosion in high-volume manufacturing environments.
Sputtering target life depends on material composition, deposition conditions, target design, and utilization efficiency. Engineered target designs can help extend target life, reduce downtime, and improve overall production efficiency.
Sputtering targets can be recycled, especially precious metal targets containing gold, platinum, or palladium. Closed-loop reclamation programs help recover valuable materials, reduce waste, and lower material costs.
Sputtering targets are manufactured using specialized metallurgical and fabrication processes designed to achieve high density and controlled grain structures. Common methods include vacuum induction melting, machining, precision bonding, and surface conditioning.
Choosing the right sputtering target supplier requires evaluating material purity, engineering capabilities, quality control standards, and manufacturing consistency. A reliable supplier should also provide Certificates of Analysis, traceability, and support for custom target configurations.
FEATURED
PVD Materials
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Other PVD Materials
ITO (In2O3:SnO2)
Tantalum Silicide (TaSi)
Aluminum Copper (AlCu)
Germanium (Ge)
Tungsten (W)
Tungsten Silicide (WSi)
Chrome Silicon (CrSi)
Chrome-Si Si-Carbide (CrSiSiC)
Nickel Platinum (NiPt)
Nickel Vanadium (NiV)
Nickel Iron (NiFe)
Nickel Chrome (NiCr)
Nickel Chrome Silicon (NiCrSi)
Niobium (Nb)
Niobium Titantium (NbTi)
Silicon Aluminum (SiAl)
Iridium (Ir)
Ruthenium (Ru)
Silver Copper (AgCu)
BONDING
We have in-house bonding services as well as custom backing plates. We can also manufacture monolithic target configurations.
Our precision cleaning service makes your job easier.
Our state-of-the-art facility in Dallas, Texas offers ultrasonic cleaning, clean room drying, and advanced surface treatments like the Twin Wire Arc Spray (TWAS) and Plasma Spray systems.
Whether you need support with materials characterization, elemental analysis, quality assurance, or process improvement, VEM’s analytical team can help identify the right testing approach for your application.