Bonding Services
Bonding Services for Thin Film and PVD Manufacturing
VEM’s bonding services support thin film and physical vapor deposition (PVD) manufacturing by joining sputtering targets to backing plates. Our state-of-the-art bonding techniques produce assemblies that are more durable, extending lifespan and reducing your cost of ownership. Every bonded assembly is backed by ultrasonic testing and traceable material sourcing.
Our bonding services help support:
- Longer assembly lifespan and reduced downtime
- Improved thermal conductivity and heat dissipation
- Lower resistivity for higher deposition rates
- Reduced risk of cracking from thermal expansion mismatch
- Verified bond integrity through ultrasonic testing
How Do Bonding Services Work?
Bonding joins a target material to a backing plate. This creates the thermal and mechanical interface a PVD system relies on for consistent heat dissipation and stable deposition.
A poorly executed bond can lead to cracking, warping, or uneven cooling. The right bonding method depends on:
- Target material
- How much it expands when heated
- Temperature the deposition process runs at
VEM offers solder bonding, elastomer bonding, and diffusion bonding. We help you select the method that best fits your material and system requirements. Solder-bonded assemblies are backed by ultrasonic analysis and testing so you can trust a VEM-bonded part to perform.
What Bonding Methods Does VEM Offer?
VEM offers three primary bonding methods, each suited to different materials. They also operate at different temperatures and have various PVD system requirements. Take a look at the table below to compare:
| Method | Process | Best Suited For |
| Solder Bonding | Uses ultra-high-purity (99.99%) Indium solder with a low melting point of 156.6°C, allowing fast turnaround and reduced wear on customer-supplied backing plates | Applications needing quick turnaround and extended backing plate lifespan |
| Elastomer Bonding | Liquid elastomer applied to bonding surfaces undergoes a low-temperature, chemically catalyzed solidification, withstanding temperatures up to 250°C | High-temperature processes, brittle materials, and materials with low coefficients of thermal expansion (CTE) |
| Diffusion Bonding | Uses Hot Isostatic Pressing (HIP) to bond materials for 200mm, 300mm, and 450mm PVD systems | High-purity titanium bonded to aluminum or alloy backing plates, where reduced resistivity supports higher deposition rates |
The low-temperature solidification used in elastomer bonding minimizes thermal contraction between the backing plate and target material. This process helps reduce mechanical stress on fragile materials. Diffusion-bonded assemblies offer reduced resistivity over mono-block designs, allowing for higher deposition rates.
VEM’s Approach to Bonding Quality
How Does VEM Test Bond Integrity?
VEM uses ultrasonic C-Scan testing to inspect bond integrity. We generate a pass/fail report for all solder-bonded assemblies against our standard specification of 98% bond coverage. We also measure concentricity to a pass/fail specification of +/-0.005″. All reports are available to customers upon request.
How Are Bonded Assemblies Cleaned and Packaged?
We clean and package all bonded assemblies in our Class 100 clean room. Then, we vacuum seal all bonds in an inert gas atmosphere to protect against contaminants. Custom packaging solutions are available upon request for non-standard parts.
Can I Trace My Bonded Assembly’s Materials?
Yes. VEM laser scribes all target material with individual lot numbers, allowing us and our customers to track these materials throughout their lifecycle.
If you can’t find what you need, simply get in touch. We’ll supply it.
Other Services Provided by VEM
In addition to bonding services, VEM supplies:
| Service | Overview |
| Sputtering Targets | High-purity target materials for PVD applications |
| Backing Plates | Precision backing plates compatible with a range of cathode systems |
| Evaporation Materials | High-purity elemental and composite materials for thermal and electron beam deposition |
Markets Served
VEM’s bonded assemblies support a wide range of markets where thermal performance and material purity are essential, such as:
| Market | Common Use Case |
| Advanced Packaging | IC packaging processes requiring ultra-pure bonded materials |
| Data Storage | Data storage device manufacturing requiring high-precision, reliable materials |
| Emerging Display Technologies | Smartphone, tablet, and display technology manufacturing demanding new material performance |
| Foundry | Semiconductor foundry fabrication across diverse material and process needs |
| LEDs | LED device fabrication on compound semiconductor substrates such as GaAs and GaN |
See all markets that we support.
Frequently Asked Questions About Bonding Services
Bonding services join target materials to backing plates, creating the thermal and mechanical interface needed for consistent heat dissipation during PVD sputtering. Reliable bonding supports:
- Stable thermal performance during high-power deposition
- Extended target and backing plate lifespan
- Reduced risk of cracking or warping
- Consistent deposition rates and film quality
VEM offers three bonding methods:
- Solder bonding, using ultra-high-purity (99.99%) Indium
- Elastomer bonding, for high-temperature and brittle material applications
- Diffusion bonding, using Hot Isostatic Pressing (HIP)
The right method depends on your material, target size, and operating temperature.
Solder bonding uses Indium solder with a melting point of 156.6°C, offering fast turnaround and high thermal conductivity. Elastomer bonding uses a chemically catalyzed liquid elastomer that solidifies at low temperature and can withstand operating temperatures up to 250°C, making it better suited to high-temperature processes and brittle materials.
Diffusion bonding uses Hot Isostatic Pressing (HIP) to bond materials for 200mm, 300mm, and 450mm PVD systems. It’s commonly used for high-purity titanium bonded to aluminum or alloy backing plates and offers reduced resistivity compared to mono-block designs, supporting higher deposition rates.
VEM tests every solder-bonded assembly using ultrasonic C-Scan testing, with results measured against:
- A standard specification of 98% bond coverage
- A concentricity specification of +/-0.005″
Pass/fail reports are available to customers upon request.
Turnaround time depends on the bonding method and part specifications. Solder bonding’s low melting point (156.6°C) generally allows for faster turnaround than elastomer or diffusion bonding. Contact us for a project-specific timeline.
Yes. VEM’s bonding services can be performed on customer-supplied materials. Reach out with your specifications and we’ll confirm compatibility with our bonding processes.
Yes. VEM laser scribes all target material with individual lot numbers, allowing full traceability throughout the material’s lifecycle. This is part of our broader commitment to material traceability and quality documentation.
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sputtering targets
We manufacture all shapes and sizes of high quality sputtering targets for all OEM platforms.
Our precision cleaning service makes your job easier.
Our state-of-the-art facility in Dallas, Texas offers ultrasonic cleaning, clean room drying, and advanced surface treatments like the Twin Wire Arc Spray (TWAS) and Plasma Spray systems.
Whether you need support with materials characterization, elemental analysis, quality assurance, or process improvement, VEM’s analytical team can help identify the right testing approach for your application.