Aluminum Silicon Copper
AlSiCu
Aluminum Silicon Copper
Data Sheet
Physical Properties
- Melting point: 600-760°C (depending on composition)
- Density: 2.70g/cm³
- Thermal Conductivity: 150-200 W/m·K
- Electrical Resistivity: 3-4 µΩ·cm at 20°C
Chemical Properties
- Atomic Number: 13 (Al) 14 (si) 29 (Cu)
- Atomic Weight: 26.98 amu (Al), 28.09 u (Si), 63.55 u (Cu)
- Crystal Structure: Face-Centered Cubic (FCC) for Al, Diamond Cubic for Si, FCC for Cu
Applications
- Electronics: Microelectronics for interconnects, bonding wires, and thin film capacitors
- Optics: Applied in reflective coatings and optical devices for its high reflectivity.
- Protective Coatings: Used in packaging to provide a barrier against moisture, oxygen, and other environmental factors
- Aerospace: Reflective Coatings
- Energy: Photovoltaics & Fuel Cells
Forms
Sputtering Targets
(any dimension)
Diameter, Rectangular, Delta & Rotatable configurations
AlSiCu Enhanced sputtering target for 300mm PVD system
AlSiCu Target for 200mm PVD system
Purity Guide
| Purity | Level | Metallic Impurities Allowed (PPM) |
| (2N) 99% | 99% | 10,000 |
| (2N5) | 99.5% | 5,000 |
| (3N) | 99.9% | 1,000 |
| (3N5) | 99.95% | 500 |
| (4N) | 99.99% | 100 |
| (4N5) | 99.995% | 50 |
| (5N) | 99.999% | 10 |
| (5N5) | 99.9995% | 5 |
| (6N) | 99.9999% | 1 |
Example of an Actual Certificate of Analysis
| Element | PPM Level | Element | PPM Level |
| Ag | 0.08 | As | <0.01 |
| Bi | 0.01 | Ca | <0.01 |
| Co | 0.01 | Ga | <0.01 |
| K | <0.01 | Li | 0.01 |
| Mn | 0.03 | Mo | <0.01 |
| Na | 0.01 | Pb | <0.01 |
| Sb | <0.01 | Sn | <0.01 |
| Zn | 0.02 | Zr | <0.01 |
| O | 6 | C | 3 |
| N | <1 | Si | 1 |
| Al | 98.5 | Cu | 0.50 |