Copper
Cu
Copper
Data Sheet
Physical Properties
- Melting point: 1083°C
- Density: 8.92 g/cm³
- Thermal Conductivity: 400 W/m·K
- Electrical Resistivity: 1.68 µΩ·cm at 20°C
Chemical Properties
- Atomic Number: 29
- Atomic Weight: 63.55 amu
- Crystal Structure: Face-Centered Cubic (FCC)
Applications
- Electronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
- Optics: Applied in reflective coatings and optical devices.
- Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
- Thermal Management: Applied in electronic devices to dissipate heat efficiently.
- Microelectronics: Employed in the fabrication of integrated circuits and transistors.
- Protective Coatings: Provides corrosion resistance and wear protection.
- Aerospace: Reflective Coatings
Forms
Sputtering Targets
(any dimension)
Diameter, Rectangular, Delta & Rotatable configurations
Copper sputtering target for 200mm PVD system
Evaporation Material
(any dimension)
Pellets, Starter Sources or Wire
Copper pellets .250” x .250”
Purity Guide
| Purity | Level | Metallic Impurities Allowed (PPM) |
| (2N) 99% | 99% | 10,000 |
| (2N5) | 99.5% | 5,000 |
| (3N) | 99.9% | 1,000 |
| (3N5) | 99.95% | 500 |
| (4N) | 99.99% | 100 |
| (4N5) | 99.995% | 50 |
| (5N) | 99.999% | 10 |
| (5N5) | 99.9995% | 5 |
| (6N) | 99.9999% | 1 |
Example of an Actual Certificate of Analysis
| Element | PPM Level | Element | PPM Level |
| Ag | 11.25 | As | 1.43 |
| Bi | 0.5 | Fe | 1.18 |
| Mn | 0.33 | Ni | 2.46 |
| Pb | 1.02 | Sb | 1.08 |
| Sn | 0.8 | Zn | 0.02 |
| O | 1 | C | 1 |
| N | 1 | H | 1 |
| S | 5.37 | Cl | 0.01 |
| P | 0.21 | F | 0.06 |