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  • Germanium

    Germanium

    Germanium


    Ge

    Germanium

    Data Sheet

    Physical Properties

    • Melting point: 938.25°C
    • Density: 5.327 g/cm³
    • Thermal Conductivity: 400 W/m·K
    • Electrical Resistivity: 1.68 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 32
    • Atomic Weight: 72.63 u
    • Crystal Structure: Diamond Cubic

    Applications

    • Electronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
    • Optics: Applied in reflective coatings and optical devices.
    • Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
    • Thermal Management: Applied in electronic devices to dissipate heat efficiently.
    • Microelectronics: Employed in the fabrication of integrated circuits and transistors.
    • Protective Coatings: Provides corrosion resistance and wear protection.
    • Aerospace: Reflective Coatings

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets or Starter Sources

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Al0.03Ca0.03
    Cu0.01Fe0.05
    Mg0.3Na0.2
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  • Titanium

    Titanium

    Titanium


    Ti

    Titanium

    Data Sheet

    Physical Properties

    • Melting point: 1668°C
    • Density: 4.506 g/cm³
    • Thermal Conductivity: 21.9 W/m·K
    • Electrical Resistivity: 42.7 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 22
    • Atomic Weight: 47.87 amu
    • Crystal Structure: Hexagonal Close Packed Cubic (HCP)

    Applications

    • Electronics: Employed in thin-film resistors, capacitors, and other electronic components.
    • Optics: Applied in reflective coatings and optical devices.
    • Thin-Film Transistors (TFTs): Employed in display technologies such as LCDs and OLEDs for improved efficiency and durability.
    • Medical: Utilized in medical implants and devices due to its biocompatibility and non-toxic nature.
    • Protective Coatings: Used in packaging to provide a barrier against moisture, oxygen, and other environmental factors
    • Wear Resistance: Enhances the durability of surfaces exposed to mechanical wear and abrasion.
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Al0.38Ca<0.2
    Cr0.33Cu0.26
    Fe3.7Li<0.005
    Mg<0.05Mo<0.05
    KNDSi0.36
    N26O210
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  • Tantalum

    Tantalum

    Tantalum


    Ta

    Tantalum

    Data Sheet

    Physical Properties

    • Melting point: 3017°C
    • Density: 16.678 g/cm³
    • Thermal Conductivity: 57.5 W/m·K
    • Electrical Resistivity: 131µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 73
    • Atomic Weight: 180.94 amu
    • Crystal Structure: Body Centered Cubic (FCC)

    Applications

    • Electronics: Diffusion barriers between copper interconnects and silicon. Capacitor electrodes in microelectronics. Gate electrodes in metal-oxide-semiconductor devices.
    • Optics: Anti-reflective coatings, optical filters and heat reflecting filters.
    • Medical: Utilized in medical implants and devices due to its biocompatibility
    • Protective Coatings: Wear-resistant coatings for cutting tools and mechanical components.
    • Wear Resistance: Enhances the durability of surfaces exposed to mechanical wear and abrasion.
    • Aerospace: Thermal barriers, oxidation-resistant layers, protective coatings for turbine components.

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of a Typical Certificate of Analysis


    Element PPM LevelElement PPM Level
    Cr3Cu5
    Fe10Mn1
    Mo1.5Nb17
    Ni6Si4
    Ti0.5W6
    Zr1O83
    C6N58
    H2
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  • Silver

    Silver

    Silver


    Ag

    Silver

    Data Sheet

    Physical Properties

    • Melting point: 961.78°C
    • Density: 10.4 g/cm³
    • Thermal Conductivity: 429 W/m·K
    • Electrical Resistivity: 1.59 x 10⁻⁸ µΩ·cm

    Chemical Properties

    • Atomic Number: 47
    • Atomic Weight: 107.87 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Used in electronic devices for their high conductivity.
    • Optics: Silver’s high reflectivity makes it ideal for mirrors and optical coatings.
    • Medical: Utilized in medical implants and devices due to its biocompatibility and non-toxic nature.
    • Sensors: Silver thin films are used in sensitive pressure sensors, due to its excellent conductivity and mechanical properties
    • Aerospace: Reflective Coatings
    • Energy: Used in solar cells to improve efficiency by enhancing light absorption and electrical conductivity

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of a Typical Certificate of Analysis


    Element PPM LevelElement PPM Level
    Al1Bi1
    Cd1Cu2
    Fe2Ni1
    Pb2Sb1
    Si1Zn1
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  • Platinum

    Platinum

    Platinum


    Pt

    Platinum

    Data Sheet

    Physical Properties

    • Melting point: 1768.3°C
    • Density: 21.45 g/cm³
    • Thermal Conductivity: 71.6 W/m·K
    • Electrical Resistivity: 10.6 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 78
    • Atomic Weight: 195.08 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Microelectronics for interconnects, conductive layers, connectors, and bonding wires
    • Optics: Reflective coatings and optical filters
    • Medical: Biocompatible coatings and implants
    • Sensors: Surface Plasmon Resonance (SPR) sensors
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of a Typical Certificate of Analysis


    Element PPM LevelElement PPM Level
    AgNDAuND
    CuNDFe1.1
    MgNDNi<4
    PdNDSiND
    SnNDZr5
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  • Palladium

    Palladium

    Palladium


    Pd

    Palladium

    Data Sheet

    Physical Properties

    • Melting point: 1555°C
    • Density: 12.02 g/cm³
    • Thermal Conductivity: 71 W/m·K
    • Electrical Resistivity: 110.8 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 46
    • Atomic Weight: 106.42 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Microelectronics for interconnects, conductive layers, connectors, and bonding wires
    • Medical Imaging: With exceptional X-ray absorbance properties make it suitable to medical imaging applications
    • Sensors: Surface Plasmon Resonance (SPR) sensors
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of a Typical Certificate of Analysis


    Element PPM LevelElement PPM Level
    Ag6Al1
    Au8Cu11
    Fe9In1
    IrNDMg4
    Ni1PbND
    Pt8RhND
    RuNDSnND
    ZnND
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  • Nickel

    Nickel

    Nickel


    Ni

    Nickel

    Data Sheet

    Physical Properties

    • Melting point: 1455°C
    • Density: 8.90 g/cm³
    • Thermal Conductivity: 90.7 W/m·K
    • Electrical Resistivity: 6.84 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 28
    • Atomic Weight: 58.69 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics:  Nickel thin films are used as electrical contacts and barriers in semiconductor devices due to their good electrical conductivity and resistance oxidation
    • Magnetic Storage: Nickel’s ferromagnetic properties make it ideal for use in magnetic storage technologies, such as hard drives and magnetic tapes
    • Electrodes: Nickel thin films are used as electrodes in certain battery technologies, such as nickel-cadmium and nickel-metal hydride batteries, due to their good electrical conductivity and stability
    • Optics: Nickel thin films are used in optical applications for reflective coatings, enhancing the performance of mirrors and other optical devices

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Cr0.01Co5.1
    Cu5.5Fe1.1
    Mg0.005Mn<0.005
    Si0.03Ti0.24
    V<0.005Zr<0.005
    N10O30
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  • Copper

    Copper

    Copper


    Cu

    Copper

    Data Sheet

    Physical Properties

    • Melting point: 1083°C
    • Density: 8.92 g/cm³
    • Thermal Conductivity: 400 W/m·K
    • Electrical Resistivity: 1.68 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 29
    • Atomic Weight: 63.55 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
    • Optics: Applied in reflective coatings and optical devices.
    • Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
    • Thermal Management: Applied in electronic devices to dissipate heat efficiently.
    • Microelectronics: Employed in the fabrication of integrated circuits and transistors.
    • Protective Coatings: Provides corrosion resistance and wear protection.
    • Aerospace: Reflective Coatings

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Ag11.25As1.43
    Bi0.5Fe1.18
    Mn0.33Ni2.46
    Pb1.02Sb1.08
    Sn0.8Zn0.02
    O1C1
    N1H1
    S5.37Cl0.01
    P0.21F0.06
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  • Gold

    Gold

    Gold


    Au

    Gold

    Data Sheet

    Physical Properties

    • Melting point: 1064.18°C
    • Density: 19.32 g/cm³
    • Thermal Conductivity: 318 W/m·K
    • Electrical Resistivity: 2.214 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 79
    • Atomic Weight: 196.97 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Microelectronics for interconnects, conductive layers, UBM, connectors, and bonding wires
    • Optics: Reflective coatings and optical filters
    • Medical: Biocompatible coatings and implants
    • Sensors: Surface Plasmon Resonance (SPR) sensors
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    C<10HfND
    H<5In<0.1
    O<15KND
    N<15LiND
    Ag<4Mg<0.1
    AlNDMnND
    AsNDMoND
    AuBalNaND
    BNDNbND
    BaNDNiND
    BeNDPND
    BiNDPb<0.1
    CaNDPd<0.2
    CdNDPt<2.5
    CeNDSbND
    ClNDSi<0.1
    CoNDSn<0.2
    CrNDTaND
    CsNDTiND
    Cu<0.2VND
    Fe<1.5WND
    GaNDZnND
    GeNDZr<0.1
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