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  • Tungsten

    Tungsten

    Tungsten


    W

    Tungsten

    Data Sheet

    Physical Properties

    • Melting Point: 3422°C
    • Density: 19.254 g/cm³
    • Thermal Conductivity: 173 W/m·K
    • Electrical Resistivity: 52.8 nΩ·m at 20°

    Chemical Properties

    • Atomic Number: 74
    • Atomic Weight: 183.84 amu (Atomic Mass Units)
    • Crystal Structure: Body-centered cubic (bcc)

    Applications

    • Microelectronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
    • Optics: Applied in reflective coatings and optical devices.
    • Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
    • Thermal Management: Applied in electronic devices to dissipate heat efficiently.
    • Microelectronics: Employed in the fabrication of integrated circuits and transistors.
    • Protective Coatings: Provides corrosion resistance and wear protection.
    • Aerospace: Reflective Coatings

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Ag11.25As1.43
    Bi0.5Fe1.18
    Mn0.33Ni2.46
    Pb1.02Sb1.08
    Sn0.8Zn0.02
    O1C1
    N1H1
    S5.37Cl0.01
    P0.21F0.06
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  • Hafnium Dioxide

    Hafnium Dioxide

    Hafnium Dioxide


    HfO2

    Hafnium Dioxide

    Data Sheet

    Physical Properties

    • Melting Point:  2758°C
    • Density: 9.68 g/cm³

    Chemical Properties

    • Chemical Formula: HfO2
    • Reactivity: Quite inert, reacts with strong acids and bases

    Applications

    • Microelectronics: HfO₂ thin films are used as high-κ dielectrics in metal-oxide-semiconductor field-effect transistors (MOSFETs). They help reduce gate leakage and improve device performance
    • Ferroelectric Memory: HfO₂-based thin films are utilized in ferroelectric random-access memory (FeRAM) and other non-volatile memory devices due to their ferroelectric properties
    • Optical Coatings: These films are used in optical coatings for lenses and mirrors, providing high refractive index and low absorption
    • Energy Harvesting: They are used in energy harvesting devices, such as pyroelectric and electrocaloric coolers, due to their ability to convert thermal energy into electrical energy

    Forms


    Evaporation Material
    (any dimension)
    Pellets or Starter Sources

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Fe6.8Al5
    B0.002Na0.05
    Si2P0.01
    S0.1Ca0.01
    Ti0.06Cr0.65
    Mn0.004Ni0.05
    Ga0.24Nb0.08
    In0.02Cu0.044
    Zn0.005Sc0.2
    Ta3.2Ir0.02
    Pt0.04
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  • Germanium

    Germanium

    Germanium


    Ge

    Germanium

    Data Sheet

    Physical Properties

    • Melting point: 938.25°C
    • Density: 5.327 g/cm³
    • Thermal Conductivity: 400 W/m·K
    • Electrical Resistivity: 1.68 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 32
    • Atomic Weight: 72.63 u
    • Crystal Structure: Diamond Cubic

    Applications

    • Electronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
    • Optics: Applied in reflective coatings and optical devices.
    • Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
    • Thermal Management: Applied in electronic devices to dissipate heat efficiently.
    • Microelectronics: Employed in the fabrication of integrated circuits and transistors.
    • Protective Coatings: Provides corrosion resistance and wear protection.
    • Aerospace: Reflective Coatings

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets or Starter Sources

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Al0.03Ca0.03
    Cu0.01Fe0.05
    Mg0.3Na0.2
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  • Titanium

    Titanium

    Titanium


    Ti

    Titanium

    Data Sheet

    Physical Properties

    • Melting point: 1668°C
    • Density: 4.506 g/cm³
    • Thermal Conductivity: 21.9 W/m·K
    • Electrical Resistivity: 42.7 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 22
    • Atomic Weight: 47.87 amu
    • Crystal Structure: Hexagonal Close Packed Cubic (HCP)

    Applications

    • Electronics: Employed in thin-film resistors, capacitors, and other electronic components.
    • Optics: Applied in reflective coatings and optical devices.
    • Thin-Film Transistors (TFTs): Employed in display technologies such as LCDs and OLEDs for improved efficiency and durability.
    • Medical: Utilized in medical implants and devices due to its biocompatibility and non-toxic nature.
    • Protective Coatings: Used in packaging to provide a barrier against moisture, oxygen, and other environmental factors
    • Wear Resistance: Enhances the durability of surfaces exposed to mechanical wear and abrasion.
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Al0.38Ca<0.2
    Cr0.33Cu0.26
    Fe3.7Li<0.005
    Mg<0.05Mo<0.05
    KNDSi0.36
    N26O210
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  • Tantalum

    Tantalum

    Tantalum


    Ta

    Tantalum

    Data Sheet

    Physical Properties

    • Melting point: 3017°C
    • Density: 16.678 g/cm³
    • Thermal Conductivity: 57.5 W/m·K
    • Electrical Resistivity: 131µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 73
    • Atomic Weight: 180.94 amu
    • Crystal Structure: Body Centered Cubic (FCC)

    Applications

    • Electronics: Diffusion barriers between copper interconnects and silicon. Capacitor electrodes in microelectronics. Gate electrodes in metal-oxide-semiconductor devices.
    • Optics: Anti-reflective coatings, optical filters and heat reflecting filters.
    • Medical: Utilized in medical implants and devices due to its biocompatibility
    • Protective Coatings: Wear-resistant coatings for cutting tools and mechanical components.
    • Wear Resistance: Enhances the durability of surfaces exposed to mechanical wear and abrasion.
    • Aerospace: Thermal barriers, oxidation-resistant layers, protective coatings for turbine components.

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of a Typical Certificate of Analysis


    Element PPM LevelElement PPM Level
    Cr3Cu5
    Fe10Mn1
    Mo1.5Nb17
    Ni6Si4
    Ti0.5W6
    Zr1O83
    C6N58
    H2
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  • Nickel

    Nickel

    Nickel


    Ni

    Nickel

    Data Sheet

    Physical Properties

    • Melting point: 1455°C
    • Density: 8.90 g/cm³
    • Thermal Conductivity: 90.7 W/m·K
    • Electrical Resistivity: 6.84 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 28
    • Atomic Weight: 58.69 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics:  Nickel thin films are used as electrical contacts and barriers in semiconductor devices due to their good electrical conductivity and resistance oxidation
    • Magnetic Storage: Nickel’s ferromagnetic properties make it ideal for use in magnetic storage technologies, such as hard drives and magnetic tapes
    • Electrodes: Nickel thin films are used as electrodes in certain battery technologies, such as nickel-cadmium and nickel-metal hydride batteries, due to their good electrical conductivity and stability
    • Optics: Nickel thin films are used in optical applications for reflective coatings, enhancing the performance of mirrors and other optical devices

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Cr0.01Co5.1
    Cu5.5Fe1.1
    Mg0.005Mn<0.005
    Si0.03Ti0.24
    V<0.005Zr<0.005
    N10O30
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  • Copper

    Copper

    Copper


    Cu

    Copper

    Data Sheet

    Physical Properties

    • Melting point: 1083°C
    • Density: 8.92 g/cm³
    • Thermal Conductivity: 400 W/m·K
    • Electrical Resistivity: 1.68 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 29
    • Atomic Weight: 63.55 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Used in semiconductor devices, interconnects, and bonding wires due to its excellent conductivity and thermal properties.
    • Optics: Applied in reflective coatings and optical devices.
    • Photovoltaics: Utilized in thin-film solar cells to improve efficiency and reduce manufacturing costs.
    • Thermal Management: Applied in electronic devices to dissipate heat efficiently.
    • Microelectronics: Employed in the fabrication of integrated circuits and transistors.
    • Protective Coatings: Provides corrosion resistance and wear protection.
    • Aerospace: Reflective Coatings

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Ag11.25As1.43
    Bi0.5Fe1.18
    Mn0.33Ni2.46
    Pb1.02Sb1.08
    Sn0.8Zn0.02
    O1C1
    N1H1
    S5.37Cl0.01
    P0.21F0.06
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  • Aluminium

    Aluminium

    Aluminium


    Al

    Aluminum

    Data Sheet

    Physical Properties

    • Melting point: 660.3°C
    • Density: 2.70g/cm³
    • Thermal Conductivity: 235 W/m·K
    • Electrical Resistivity: 2.65 µΩ·cm at 20°C

    Chemical Properties

    • Atomic Number: 13
    • Atomic Weight: 26.98 amu
    • Crystal Structure: Face-Centered Cubic (FCC)

    Applications

    • Electronics: Microelectronics for interconnects, bonding wires, and thin film capacitors
    • Optics: Applied in reflective coatings and optical devices for its high reflectivity.
    • Protective Coatings: Used in packaging to provide a barrier against moisture, oxygen, and other environmental factors
    • Aerospace: Reflective Coatings
    • Energy: Photovoltaics & Fuel Cells

    Forms


    Sputtering Targets
    (any dimension)
    Diameter, Rectangular, Delta & Rotatable configurations

    Evaporation Material
    (any dimension)
    Pellets, Starter Sources or Wire

    Purity Guide


    Purity  LevelMetallic Impurities Allowed (PPM)
    (2N) 99%99%10,000
    (2N5)99.5%5,000
    (3N)99.9%1,000
    (3N5)99.95%500
    (4N)99.99%100
    (4N5)99.995%50
    (5N)99.999%10
    (5N5)99.9995%  5
    (6N)99.9999%  1

    Example of an Actual Certificate of Analysis


    Element PPM LevelElement PPM Level
    Ag<0.01Cu0.17
    Si0.47Fe0.16
    Ti0.03Mn0.02
    Mg0.17Zn0.01
    Ni0.01Cr0.02
    Na0.01U<0.1
    Th<0.1
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