
Gold Sputtering Targets for Thin Film and PVD Manufacturing
Gold sputtering targets are source materials used to deposit gold thin films through physical vapor deposition (PVD). Gold’s electrical and thermal conductivity, corrosion resistance, and stability make it useful across demanding thin film applications.
Vacuum Engineering & Materials (VEM) supplies materials and services for thin film and PVD manufacturing, backed by decades of experience supporting both research and production requirements.
Founded in 1987, VEM now serves more than 300 customers worldwide. Our capabilities have expanded from material distribution and bonding services into precious metals melting and manufacturing, analytical testing, and additional materials-processing capabilities.
For additional materials and target options, explore VEM’s complete range of sputtering targets.

Gold Sputtering Targets
The Mechanics of a Gold Sputtering Target
A gold sputtering target is a solid gold source material used in a sputtering system to produce a thin gold coating on a substrate.
During sputtering, energetic ions bombard the target surface and eject atoms from the gold material. Those atoms travel through the vacuum environment and condense onto the substrate to form a thin film.
The target is therefore an integral part of the deposition process. Material composition, target dimensions, manufacturing quality, and compatibility with the deposition equipment all need to be considered when specifying a target.
Why Is Gold Used for Sputtering?
Gold (Au) combines several physical and electrical characteristics that make it useful as a thin film material.
Important characteristics of gold include:
- High electrical conductivity
- High thermal conductivity
- Resistance to corrosion and oxidation
- Chemical stability
- Ductility and malleability
- Reflective properties
These properties have led to the use of deposited gold films in applications including semiconductors, sensors, batteries, and data storage.
Gold is also a dense material, with a theoretical density of approximately 19.32 g/cm³, and has a melting point of approximately 1,064°C.
Gold Material Properties
Understanding the fundamental characteristics of gold can help engineers evaluate it for a thin film application.
| Property | Gold (Au) |
| Symbol | Au |
| Atomic Number | 79 |
| Atomic Weight | 196.966569 |
| Crystal Structure | Face-centered cubic |
| Density | Approximately 19.3 g/cm³ |
| Melting Point | Approximately 1,064°C |
| Thermal Conductivity | Approximately 318–320 W/m·K |
Exact material requirements should be established according to the deposition process, target specification, and finished-film requirements.
Gold Sputtering Target Purity
Purity is an important specification when sourcing a gold sputtering target because the target acts as the source material for the deposited film.
Commercial gold sputtering targets are available in multiple purity levels, and the appropriate specification depends on the deposition process and application. Instead of assuming that every process requires the highest available purity, manufacturers should evaluate factors such as:
- Required film composition
- Acceptable impurity levels
- Process sensitivity
- Device or coating requirements
- Customer specifications
- Quality and documentation requirements
Gold Target Geometry and Equipment Compatibility
Target geometry should be considered together with the sputtering equipment in which the target will operate.
Dimensions can vary according to the sputtering gun or cathode, which makes equipment compatibility an important part of target specification. Diameter, thickness, length, width, and overall geometry can all affect whether a target is appropriate for a particular system.
When specifying a replacement or custom gold sputtering target, useful information can include:
- Existing target dimensions
- Equipment manufacturer
- Cathode or source model
- Target drawings
- Backing or assembly configuration
- Production requirements
- Material specifications
For a deeper look at the relationship between target design and deposition performance, learn more about custom sputtering targets to boost film uniformity and utilization.
Target Bonding and Backing Requirements
Some sputtering applications use a target bonded to a backing plate rather than an unsupported target. VEM has provided bonding services since 1989, giving the company decades of experience in this part of target manufacturing and assembly.
The appropriate configuration depends on the target material, dimensions, equipment, and operating requirements. These factors should be evaluated as part of the complete target specification rather than treating the source material and target assembly as unrelated components.
Why Gold Target Design Matters
A sputtering target is not simply a piece of raw material. Its physical configuration must work within a specific deposition system. During operation, material is removed from the target as part of the sputtering process. The resulting erosion pattern depends on the deposition equipment and operating conditions.
That makes several design considerations important:
- Correct dimensions
- Equipment compatibility
- Target thickness
- Target geometry
- Assembly requirements
- Material utilization
These considerations become especially significant for precious metals because material remaining after the target’s useful operating life still has intrinsic value.
VEM’s broader sputtering-target engineering approach addresses film uniformity. Learn more about custom sputtering targets and target utilization.
Gold Sputtering Targets and Material Utilization
Material utilization deserves particular attention when working with gold.
Sputtering does not necessarily consume every area of a target equally. Depending on the cathode and operating conditions, some material may remain when the target is removed from service. With a precious metal, that remaining material represents recoverable value.
Target selection should therefore account for more than initial material cost. Manufacturers can also consider:
- How the target fits the deposition source
- Expected erosion behavior
- Target dimensions and geometry
- Amount of usable target material
- Replacement requirements
- Opportunities to recover remaining precious metal
Considering the complete target lifecycle provides a more useful view of gold target economics than purchase price alone.
Applications for Gold Thin Films
Gold thin films are used where the properties of gold are beneficial to the finished component or device.
Semiconductors and Electronics
Gold’s electrical conductivity makes deposited gold films useful in semiconductor and electronic applications requiring conductive material.
Sensors
Deposited gold is used in sensor applications where electrical and surface properties are important to the device.
Data Storage
Gold films can be used in data-storage applications as part of thin film structures that require the material’s conductive and stable characteristics.
Batteries and Energy Applications
Deposited gold films are also used in battery-related applications and research where conductivity and chemical stability are required.
Optical and Reflective Applications
Gold’s reflective properties make thin gold coatings relevant to selected optical and reflective applications.
Quality and Analytical Capabilities
Consistency in thin film manufacturing depends on control of both the materials and processes.
VEM has expanded its quality and analytical infrastructure over time, including:
- ISO 9001 certification achieved in 2008
- ISO 9001:2015 certification achieved in 2017
- ICP-OES analytical capabilities
- SEM-EDX analytical capabilities
- Expansion of its quality organization in 2022
- Addition of a new automated CMM in 2023
These capabilities support VEM’s work with thin film and PVD manufacturers that require controlled materials, manufacturing, inspection, and responsive technical support.
What to Specify When Requesting a Gold Sputtering Target
Providing a complete target specification can make the sourcing and manufacturing process more efficient.
When requesting a gold sputtering target, provide available information about:
- Required material and purity
- Target dimensions
- Target geometry
- Quantity
- Deposition equipment
- Cathode or source model
- Backing or bonding requirements
- Existing drawings or specifications
- Application requirements
- Quality or analytical requirements
If an existing target is being replaced, information about the current part and deposition system can also help define the required configuration.
Why Choose VEM for Gold Sputtering Targets?
Vacuum Engineering & Materials has served the thin film and PVD manufacturing industries since 1987.
VEM’s capabilities include:
- Thin film and PVD materials
- Sputtering targets
- Bonding services dating to 1989
- Expanded manufacturing capabilities
- Precious-metals melting and manufacturing
- Vacuum hot pressing and powder metallurgy capabilities
- ICP-OES analysis
- SEM-EDX analysis
- Automated CMM inspection capabilities
- Precious-metal reclamation equipment
- Precious-metal refining
- Vacuum induction melting
- ISO 9001:2015 certification
Bringing these capabilities together allows VEM to support customers across multiple stages of a thin film materials requirement.
Request a Gold Sputtering Target Quote
Founded in 1987 and serving more than 300 customers worldwide, VEM combines decades of industry experience with materials, bonding, analytical, manufacturing, and precious-metal capabilities.
The right gold sputtering target starts with the requirements of the deposition process.
Request a quote for your gold sputtering target requirements.
Frequently Asked Questions About Gold Sputtering Targets
A gold sputtering target is gold source material used in a sputtering deposition process. Energetic ions bombard the target and eject gold atoms, which travel through the vacuum environment and deposit onto a substrate to form a thin film.
Deposited gold films are used in applications including semiconductors, sensors, batteries, and data storage. Gold is useful as a thin film material because of characteristics including:
- High electrical and thermal conductivity
- Chemical stability
- Corrosion resistance
- Reflectivity
Au is the chemical symbol for gold. Gold has atomic number 79, an atomic weight of approximately 196.97, and a face-centered cubic crystal structure.
The appropriate purity depends on the deposition process, required film composition, allowable impurity levels, and application specifications. Gold sputtering targets are commercially available in multiple purity grades.
Yes. Bonding has been part of VEM’s services since 1989. Whether a particular gold target requires a bonded configuration depends on the target, equipment, and application requirements.
Sputtering targets must fit and operate correctly within the intended deposition source. Dimensions and geometry also relate to how material is consumed during sputtering, making equipment compatibility and target design important considerations when specifying a target.
Gold remaining after a sputtering target is removed from service retains precious-metal value. VEM installed precious-metals reclamation equipment in 2019 and completed a refining unit in 2021 as part of its precious-metals capabilities.
VEM established an analytical laboratory with ICP-OES in 2011 and added SEM-EDX capabilities in 2016. The company has continued expanding its quality and inspection capabilities, including the addition of a new automated CMM in 2023.
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Other PVD Materials
ITO (In2O3:SnO2)
Tantalum Silicide (TaSi)
Aluminum Copper (AlCu)
Germanium (Ge)
Tungsten (W)
Tungsten Silicide (WSi)
Chrome Silicon (CrSi)
Chrome-Si Si-Carbide (CrSiSiC)
Nickel Platinum (NiPt)
Nickel Vanadium (NiV)
Nickel Iron (NiFe)
Nickel Chrome (NiCr)
Nickel Chrome Silicon (NiCrSi)
Niobium (Nb)
Niobium Titantium (NbTi)
Silicon Aluminum (SiAl)
Iridium (Ir)
Ruthenium (Ru)
Silver Copper (AgCu)

BONDING
We have in-house bonding services as well as custom backing plates. We can also manufacture monolithic target configurations.





